Dmg Teco

Total Etch Bond

TECO is the innovative total-etch bonding system from DMG. Besides its excellent bond strength properties, TECO (= Total Etch Control) stands out thanks to its unique DMG patented single dose application form: the »SilvR dose«. The material is freshly activated by simply pressing on the silver chamber and can be used immediately. Application is carried out in just one step – with one hand, quickly and cleanly

COMPOSITION:

TECO: Bis-GMA-based resin matrix, starter, additives

DMG Etching Gel: o-phosphoric acid in water (37 %), Aerosil

INDICATIONS:

Light-curing dentine and enamel bonding agent in conjunction with the total etch technique for use with light-curing composites and compomers for direct and indirect restorations of cavity classes I - V

FEATURES:

Reliable bonding with push-button convenience. Get the reliability you need with the dependability of a total etch bonding system in an innovative singledose dispenser with TECO.

Outstanding bonding properties:

TECO offers a microtensile bond strength of 38 Mpa* – far superior to the accepted industry standard for optimal adhesion. Its non-acetone formulation works with all curing lights.

Unique fast and easy application system

The bonding material is activated by a simple push on the patented “SilvR” single-dose package and may be used immediately. The built-in micro brush applicator easily slides out of the SilvR dose capsule. Application is a one-step, one-hand, fast, clean and safe process.

Proven Total Etch technology

TECO can be used with a wet or moist bonding technique. The Total Etch method ensures exceptional bond strength and durability

PACKAGING:

• 1 x 5ml Bottle